Enhanced Modular Versatility: The Innovative Wheel Pack Assembly
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NDT UNLOCKED
Knowledge Level - NDT Level I/NDT Level II
Knowledge Level - NDT Level III
Knowledge Level - Student
Presentation Topic Level - Advanced
Presentation Topic Level - Intermediate
Presentation Topic Level - Novice
Target Audience - General Interest
Target Audience - Level III Managers
Target Audience - Research/Academics
Target Audience - Small Business Managers
Target Audience- NDT Engineers
Target Audience- Technicians/Inspectors
| Thursday, October 9, 2025 |
| 9:45 AM - 10:15 AM |
| Monterey 2-3 |
Speaker
Chuck Anderson
Sme, Sales & Customer Manager
Scantech Instruments, Inc.
Enhanced Modular Versatility: The Innovative Wheel Pack Assembly
Presentation Description
ScanTech’s Wheel Pack Assembly (WPA) is a 2.5 lb. compact motorized and encoded magnetic wheel capable of pulling 25+ lbf (/40 lbf max) per wheel. Its versatile and modular design has already been incorporated into multiple scanners, powering; the Axis (B‑scan), the Radix (welds), and our newest chain-based scanner (RT-DR and UT for welds). It is also compatible with our battery powered remote control system making wireless operation a reality with our new Batt Pack controller. Our STC (ScanTech Control) bus provides amazing versatility in allowing the Wheel Pack Assemblies to vary in number and configuration. In this session you will:
1. See a live demo of the versatility and modularity of this technology.
2. Explore real field deployments: Five customer‑specific configurations discussed.
3. Review API 653 & ASME B31G workflows: From corrosion mapping to compliant data reporting.
1. See a live demo of the versatility and modularity of this technology.
2. Explore real field deployments: Five customer‑specific configurations discussed.
3. Review API 653 & ASME B31G workflows: From corrosion mapping to compliant data reporting.
Short Course Description
Biography
Have served the NDT community for 12 years as a Sales Rep/Manager, SME, and Technical Support Professional. This includes 7 years with Olympus and nearly 5 years with ScanTech Instruments, Inc. During this time, I have developed expertise in all fields of UT inspection including Thickness, Flaw Detection, Phased Array, and specifically Automated Ultrasonic Testing. Exposure to various applications across many industries along with a high interest in helping customers solve their application requirements has put me in a position to be an SME that has the customer's needs in focus.
